25K/Bottle Leaded BGA Solder Balls For IC Chip Soldering Reballing Ball Sn63Pb37 Tin Material 0.2-0.76MM Rework Repair Tools Accessories
Description:
Sn63Pb37 and high quality.
Solder (Tin) paste is the best choice of reballing IC.
It is used instead of the pin in the IC component package structure.
Specification:
Size:0.2mm/0.25/0.3mm/0.35mm/0.4mm/0.45mm/0.5mm/0.55/0.6mm/0.65mm/0.76mm
Quantity: 25,000PCS per Bottle
Condition: Brand New
Balls Alloy: Sn63/Pb37
Standard: RoHs Available & SGS Tested
Package include:
1pcs (0.2-0.76mm) x BGA solder Balls
