FUXIN Genuine Thermoelectric Cooler Peltier TEC1-09605FX TEC1-12705FX TEC1-12706 Wine Cabinet Water Dispenser Refrigeration Chip
TEC1-12703
Chip Type: TEC1-12703
Dimension: 40*40*4.5mm
Element Quantity: 127 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 3A
Max Current: Imax = 3.3A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 36W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
TEC1-12705FX
Chip Type: TEC1-12705FX
Dimension: 40*40*3.9mm
Element Quantity: 127 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 5A
Max Current: Imax = 5.5A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 60W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
TEC1-12706
Chip Type: TEC1-12706
Dimension: 40*40*3.8mm
Element Quantity: 127 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 6A
Max Current: Imax = 6.8A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 72W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
TEC1-12708FX
Chip Type: TEC1-12708
Dimension: 40*40*3.6mm
Element Quantity: 127 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 8A
Max Current: Imax = 8.8A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 96W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
TEC1-12710
Chip Type: TEC1-12710
Dimension: 40*40*3.4mm
Element Quantity: 127 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 10A
Max Current: Imax = 10.8A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 120W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
TEC1-09605FX
Chip Type: TEC1-09605FX
Dimension: 40*40*3.9mm
Element Quantity: 96 pairs
Internal Resistance: 2.2 ~ 2.3Ω
Maximum Temperature: Tmax (Qc = 0) over 65℃
Rated Current: I=standard (A): 5A
Max Current: Imax = 6A (rated at 12V)
Rated Voltage: 12V (Vmax: 15.5V)
Assembly Pressure: 95N/cm2
Refrigeration Capacity: Qcmax 45W
Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency)
Packaging: standard 704 silicone rubber seal
Installation and precautions
Connecting a 12 volt power supply to the cooling plate will cause a temperature difference on both sides, with one side cold and the other hot. Do not power on the refrigerator for a long time without a radiator, otherwise it will cause overheating and burning inside the refrigerator.
The installation and use of refrigeration pads are very simple. Before installation, it is better to prepare a little thermal conductive silicone grease. Then, find a Dry cell and connect it to the two leads of the cooler. You can feel that one end is obviously cool and the other end is hot. Remember the polarity of the lead and determine the cold and hot ends of the cooler. If you want to obtain a larger cooling capacity, it is recommended to use a two-stage cooling method, which is to use two pieces stacked together, with the cold surface of the upper piece absorbing the heat of the lower piece. Experiments have shown that two-stage cooling is much better than single-stage cooling. If conditions permit, you can choose a three-level cooling method, and of course, it needs to be supported by a high-power power supply.
According to the installation requirements of semiconductor cooling sheets, in addition to using thermal blocks, the semiconductor cooling sheets, thermal blocks, heat sinks, and fans should be pre made into components; A semiconductor cooling plate is placed between the thermal conductivity block and the heat sink and fixed with four nylon screws. (During full power operation, the semiconductor cooling plate absorbs excessive heat, which can easily cause condensation and freezing. Based on experience, the power consumption is about 16W when applying 5V voltage to it; it is relatively small. The power consumption is about 30W when applying 8V voltage.)
After connecting to the DC power supply, the electrons start from the negative electrode (-) and first pass through the P-type semiconductor, where they absorb heat. They then reach the N-type semiconductor and release heat. After passing through each NP module, heat is sent from one side to the other, causing a temperature difference and forming a cold and hot end.
