chip stick memory flash 4GB 8GB 16GB 32GB 64GB 128GB USB 2.0 short board U disk semi-finished chip pendrive Factory wholesale

UDP Long Dimensions: 24mm x 11mm x 1.4mm
UDP Stroke Dimensions: 15mm x 11.3mm x 1.4mm

One piece suit WAFER packaging technology
Thin, light, fashionable
Easy and simple assembly
Product standardization, suitable for customers to make a variety of mold design on this basis
UDP module + shell = disk U
Due to the small size of UDP module, it is convenient for designing various types of enclosures, And assembly is simple, and virtually seamless is necessary, which can greatly improve the production capacity and reduce the production cost of U disk.
————————————————————————————————————————————————–
Waterproof, dust resistant and impact resistant.
UDP (USB Disk in Frames And Display Items) uses a new processing technology called PIP encapsulation. PIP is a shorthand for the Product In Frames And Exhibitions English. The technology integrates PCB assembly substrate and semiconductor packaging process, E directly encapsulates the components needed for the small memory card (IC flash controller passive component substrate) to form a finished flash memory card product. For consumers, the technique of direct PIP consequences advantages are obvious: high read/write speed, robustness (up to 50 Newtons), strong waterproof, anti-static, high temperature resistance, etc. It is the best choice for digital storage. Based on industry insiders, the birth of integrated packaging technology has made digital storage product packaging technology a step forward, and is set to become the mainstream packaging technology for small memory cards.
——————————————————

For consumers, the direct consequences of PIP technological advantages are obvious: large capacity memory card, high read/write speed, robustness (strong pressure resistance of 50 Newton), strong waterproof, anti-static, high temperature resistance, etc. The combination of advantages is definitely the best choice for digital memory cards. Based on industry insiders, the birth of integrated packaging technology has made digital storage product packaging technology a step forward, and is set to become the mainstream packaging technology for small memory cards.

1, quality assurance, not fake

Most memory cards on the market are basically packaged flash memory chips purchased from the manufacturer. After welding on the substrate, two plastic plates are used for ultrasonic welding. Finally, paper labels are used for labelling. This kind of practice is very easy for forgers to make their hands and feet. For example, paper labels can be replaced, plastic chip can be opened to replace internal flash memory chip, Or counterfeit goods can be directly connected to brand label, etc., so that consumer interests are damaged.

Xinkete PIP memory card package starts from purchasing the most original wafer, and then uses PIP packaging technology per package of all parts at once. There’s no space on the card. To copy Kingmax’s unique PIP packaging technology, the minimum investment is required. At the threshold of more than 100 million yuan to enter the BGA package, some counterfeiters can only withdraw, which is the main reason why Kingmax memory cards do not have fakes.

2, Long service life, energy saving

Products using Kingmax PIP packaging technology follow the patented exclusive TinyBGA technology in the memory field, fully encapsulating working components inside, the operating temperature components are not eroded by external dust and debris, and are not affected by sunlight. Product loss is reduced by packaging technology, and product life is improved.

In addition, due to the adoption of DSLC technology, the memory card to write life is up to 100,000 times, memory card far superior to the general’s life currently on the market, and DSLC technology is more energy efficient than the general MLC technology.

3, waterproof, heat and pressure resistance, challenge the limit

For consumers, PIP package memory cards are also unique in terms of water resistance, high temperature resistance and pressure resistance. Since the memory card is completely closed and falls into water, data will not be lost due to water not damaging the components work. The encapsulation layer is made of a unique material and is completely considered for insulation and pressure resistance. According to the test results, U disk with PIP packaging technology will not lose data in 100 degrees of water, and can withstand the weight of a truck.

4, coloured, visual enjoyment

Using the advantages and features of PIP packaging technology, U disk can be made in any desired style, so Xinkete U disk also has a unique style, and created a beautiful U disk color, the first in the industry