FUXIN Genuine Thermoelectric Cooler Peltier TEC1-09605FX TEC1-12705FX TEC1-12706 Wine Cabinet Water Dispenser Refrigeration Chip

FUXIN Genuine Thermoelectric Cooler Peltier TEC1-09605FX TEC1-12705FX TEC1-12706 Wine Cabinet Water Dispenser Refrigeration Chip

TEC1-12703

Chip Type: TEC1-12703

Dimension: 40*40*4.5mm 

Element Quantity: 127 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 3A

Max Current: Imax = 3.3A (rated at 12V)  

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 36W

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

TEC1-12705FX

Chip Type: TEC1-12705FX 

Dimension: 40*40*3.9mm 

Element Quantity: 127 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 5A

Max Current: Imax = 5.5A (rated at 12V)  

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 60W 

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

TEC1-12706

Chip Type: TEC1-12706

Dimension: 40*40*3.8mm

Element Quantity: 127 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 6A

Max Current: Imax = 6.8A (rated at 12V) 

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 72W 

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

TEC1-12708FX

Chip Type: TEC1-12708

Dimension: 40*40*3.6mm

Element Quantity: 127 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 8A

Max Current: Imax = 8.8A (rated at 12V) 

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 96W 

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

TEC1-12710FX

Chip Type: TEC1-12710FX

Dimension: 40*40*3.4mm

Element Quantity: 127 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 10A

Max Current: Imax = 10.8A (rated at 12V) 

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 120W 

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

TEC1-09605FX

Chip Type: TEC1-09605FX

Dimension: 40*40*3.9mm

Element Quantity: 96 pairs 

Internal Resistance: 2.2 ~ 2.3Ω 

Maximum Temperature: Tmax (Qc = 0) over 65℃ 

Rated Current: I=standard (A): 5A

Max Current: Imax = 6A (rated at 12V) 

Rated Voltage: 12V (Vmax: 15.5V) 

Assembly Pressure: 95N/cm2

Refrigeration Capacity: Qcmax 45W 

Working Environment: -55℃~ 83℃(high ambient temperatures drop directly affect the cooling efficiency) 

Packaging: standard 704 silicone rubber seal

Installation and precautions

Connecting a 12 volt power supply to the cooling plate will cause a temperature difference on both sides, with one side cold and the other hot. Do not power on the refrigerator for a long time without a radiator, otherwise it will cause overheating and burning inside the refrigerator.

The installation and use of refrigeration pads are very simple. Before installation, it is better to prepare a little thermal conductive silicone grease. Then, find a Dry cell and connect it to the two leads of the cooler. You can feel that one end is obviously cool and the other end is hot. Remember the polarity of the lead and determine the cold and hot ends of the cooler. If you want to obtain a larger cooling capacity, it is recommended to use a two-stage cooling method, which is to use two pieces stacked together, with the cold surface of the upper piece absorbing the heat of the lower piece. Experiments have shown that two-stage cooling is much better than single-stage cooling. If conditions permit, you can choose a three-level cooling method, and of course, it needs to be supported by a high-power power supply.

According to the installation requirements of semiconductor cooling sheets, in addition to using thermal blocks, the semiconductor cooling sheets, thermal blocks, heat sinks, and fans should be pre made into components; A semiconductor cooling plate is placed between the thermal conductivity block and the heat sink and fixed with four nylon screws. (During full power operation, the semiconductor cooling plate absorbs excessive heat, which can easily cause condensation and freezing. Based on experience, the power consumption is about 16W when applying 5V voltage to it; it is relatively small. The power consumption is about 30W when applying 8V voltage.)

After connecting to the DC power supply, the electrons start from the negative electrode (-) and first pass through the P-type semiconductor, where they absorb heat. They then reach the N-type semiconductor and release heat. After passing through each NP module, heat is sent from one side to the other, causing a temperature difference and forming a cold and hot end.